This 3-day course is designed to focus primarily on lead-free soldering techniques as applied to TH technology, SMT and inspection. The student will gain a basic understanding of lead-free alloys and their advantages and disadvantages plus a more detailed knowledge of soldering in accordance with IPC-J standard, IPC 7711/7721 and IPC-610.
Basics of Soldering
Solder/flux/solder paste-alloys, lead free alloys and their advantages/disadvantages, reflow temperatures, rheology Component ID ESD MSD Tip care and maintenance In accordance with IPC-J standard 001
TH Technology, Wires and Terminals
TH soldering and removal Barrel/annular ring repair Soldering wires and terminals In accordance with IPC-J standard 001 and IPC-7711/7721
SMT soldering and removal of chip caps, resistors, SOIC’s, PLCC, QFP’s, QFN’s Track and pad repair in accordance with IPC-J standard 001 and IPC-7711/7721
Inspection to class 1, 2 and 3 In accordance with IPC-610