Lead free alloys characteristics are discussed and the differences and similarities explored. The student will become familiar with the IPC component identification desk reference manuals and workmanship standards as they pertain to SMT technology. The class will be introduced to surface mount technology and be asked, after appropriate demonstrations, to construct a SMT board. Types of components are varied and include components ranging from 1206 chip components, SOT’s, SOIC’s PLCC’s to fine pitch gull wing devices. All students will be required to install some components using lead free solders.
Upon completion of all component types the students will remove the components using a variety of conductive and convective methodology. The goal is to remove all components without inducing damage to the board. Upon successful completion of the course students will receive a Circuit Technology Certification good for a period of two years.
This is a comprehensive hands-on course designed for the beginner to intermediate soldering and rework technician. It will instruct the student on:
Protection of electronic circuitry from the hazards of ESD (Electrostatic Discharge)
Basic component identification
Basic skills in SMT (surface mount technology) installation
Removal using state of the art workstations
The course is structured to be in accordance with IPC-610, 7711 and J standard:
Basic ESD concepts
Minimizing ESD in the workplace
General ESD rules
General IPC terms and definitions (product classifications, acceptance criteria, etc.)
Selected common electronic terms
The class will familiarize themselves with the solder/desolder rework stations and become comfortable with soldering tip care and safety. The class will study the basics of soldering including the nature of:
Proper cleaning methodology
Formation of intermetallics
Solder melting points, etc.