J Standard Soldering Process
This is a comprehensive, hands-on solder training program based on J-STD-001. The program describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry consensus requirements for a broad range of electronic products. The CIT level certification is an engineering level course designed to allow the successful candidate to certify individuals in their company to the J-STD CIS level or to simply be a higher level certification. Candidates for this course should have a broad range of experience in the electronics industry and some skills in interconnecting both PTH and SMT components and some background in technical training.
Who should become an IPC J-STD-001 Certified IPC Trainer?
Assembly process engineers, quality assurance supervisors, training managers and others responsible for the quality and reliability of soldered electronic assemblies are excellent candidates for the program. Any company that uses J-STD-001 or is considering its adoption can use the program to address the training requirement identified in the standard. While there are no formal entrance requirements, Certified IPC Trainer candidates must have excellent hand soldering skills and ideally in training as well.
This module is an introduction and overview to the entire contents of J-STD-001 Rev G and is a prerequisite to any of the following four technical specific modules. Module 1 consists of lecture, review, and an open and closed book written exam.
Wires and Terminals
This module provides requirements for wire and terminal applications consisting of lecture, review, and instructor demonstrations. The students will prepare and solder wires to turret, bifurcated, J-hook, pierced, and cup terminals. Students must demonstrate proficiency in preparing and soldering wires to the above terminal types and pass the open book exam.
This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations. Students must prepare and solder through hole components to a printed circuit board. Components include a variety of axial and radial leaded devices. Students must also remove components from a PCB in a non-destructive manner. Students must demonstrate proficiency in the above and also pass the end open book exam.
Surface Mount Technology (SMT)
This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. Components types include 1206 through 0402 chips, SOIC’s, PLCC’s, SOT’s, QFP’s, TSOP’s, etc. The students must demonstrate proficiency in various types of installations (convective and conductive) and removals and pass an open book examination.
This module provides requirements for inspection methodology and a basic introduction to process control issues. Through lecture and actual inspections of a sample PCB the student will demonstrate their proficiency in identifying acceptable and defective conditions according to the Standard. An open book examination is also required.