ONLINE SOLDER TRAINING: GREEN AND EFFICIENT.

Online Training                                                 
Technical proficiency can dramatically increase effectiveness in the manufacturing environment including hand soldering and solder process control. The CTI "Online Solder Training" or OST program provides the flexibility of distance learning without sacrificing content or classroom / peer interaction. All of our OST classes are presented with a live IPC certified trainer and student participation is required, these are not recorded video sessions.

Circuit Technology, Inc. Certified Classes, Online Solder Training Format.
CTI has taken its popular custom classes and developed a online solder training format that maintains the integrity and content of these classes while still allowing a the student to participate in his own environment. These are unlike most other online formats in that there is a live instructor online presenting the material and interacting with the students.

Our suite of classes consist of ESD Awareness, Component Identification, Basics of Soldering, Introduction to SMT soldering, Lead Free Soldering, ESD Compliance Ansi 20.20, BGA Profiling and the IPC review classes where once each quarter we will review the 610, JSTD-001, and 7711/7721 specification online. The IPC reviews are great for preparation for upcoming re-certification or just to remind yourself how to efficiently use the standard. Also a great time to ask the instructor questions about the specification.

OST Class Descriptions
Counterfeit Components $150.00/student The problem of counterfeit components is quickly becoming the biggest issue facing companies assembling printed circuit boards.  No one is immune to the plague as even defense and medical companies have been affected.  So how can you recognize and even prevent counterfeit components from infiltrating your assembly process? Register for this important WebCast to learn how to better recognize and prevent this problem.

Basics of Soldering $275/student (multi discounts available) This class covers the common solder alloys and their characteristics, including lead free alloys. All the mechanism needed to create a reliable solder connection are discussed such as intermetallic bonding, time and heat balancing and tools and chemicals necessary. The student will see how the time temperature profile is an important concept for understanding proper heat and time management for reliable solder joints. Inspection and industry standards for workmanship are discussed as well as ESD awareness.

ESD Awareness $275.00/ student(multi student discounts available) ESD terms and definitions, ESD vs EOS, charge sources and potentials, acceptable workstation configurations, static dissipative materials, antistatic materials, and static shielding materials, all training in accordance with Ansi 2020 and IPC standards.

Component Identification $275.00/student (discounts available) This course covers updated information on small shrink outline package, thin small outline package, quad flat pack, low-profile quad flat pack, plastic quad flat package, leadless chip carrier, quad flat no-lead, and ball grid array-related packages, including all the variations within those groups; new components include dual flat no-lead, quad flat no-lead multi-row, package on package, chip scale package, chip on board, bare die, and flip chip as well as your axial and radial leaded PTH components and color code understanding and reading.

Introduction to IPC
This is a live session with IPC instructors at Circuit Technology. We discuss interactively what each certification covers and how it is presented to students. We then give you a better understanding of which classes you need and in what order the training should go. If you are trying to decide on IPC courses or have any questions about the certifications this is a must session for you.

Intro to BGA Profiling Introductory Price $250.00/Student (multi student or company wide rates/discount available. This 2 hour interactive IPC Master Instructor led online class will cover BGA terminology, basics of soldering including intermettalic bonding, solder and flux chemistries and workmanship criteria for BGA solder joints. Time Temperature Profiling will be studied indept including preheating, soaking, time above liquidous and cooling. Inspection techniques and methodologies will be explored, including look under scope and Xray technologies.

How to get the Most from your REWORK Equipment This one hour session discusses the most effective use of your rework equipment. Topics such as proper maintenance, storage, setup, new state of the art techniques, typical program settings and others are detailed for the student. Each student will see the proper usage of the different hand pieces available in the market today as well as the proper maintenance and care techniques. All instruction done in accordance to JSTD-001 and other IPC related documents.